FCT AMP WASH
Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
- Ultra-Low Voiding Performance
- Excellent Print and Reflow Characteristics
- Designed For Use with a Variety of Pb-Free Solder Alloys
Product Description
AMP Wash Water-Soluble Pb-Free Solder Paste is a water-soluble, lead-free solder paste formulated for SMT printing and reflow soldering applications. The material is designed to deliver ultra-low voiding performance while producing flux residues that can be removed using deionized water. AMP Wash is compatible with multiple lead-free alloy systems, including SAC305, SN100CV, LF-C2, and TempSave B37, supporting both high-reliability and low-temperature assembly requirements. The paste provides stable printing characteristics, broad process compatibility, and washability that can simplify post-solder cleaning in electronics manufacturing environments.
Key features
- Ultra-low voiding performance: Developed to minimize solder-joint voiding in SMT assembly applications.
- Water-soluble flux system: Flux residues can be removed using heated deionized water in standard washing equipment.
- Multi-alloy compatibility: Supports SAC305, SN100CV, LF-C2, TempSave B37, and selected anti-tombstoning alloy systems.
Applications / Suitable for
- Surface-mount technology (SMT) assembly
- Printed circuit board reflow soldering
- High-reliability electronic assemblies using LF-C2 and SN100CV alloys
- Low-temperature soldering processes using TempSave B37 alloy
TDS, SDS & Technical Documents
Technical Specifications
Other Properties
Additional Information
As-supplied / before-processing properties
Representative processing and handling properties published for AMP Wash solder paste.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Shelf Life | 9 | months | Stored at 0–10°C |
| Storage Temperature | 0–10 | °C | Recommended storage condition |
| Working Temperature | 18–29 | °C | Room-temperature use after warming |
| Stencil Life | 8 | hours | 18–29°C and 30–70% RH |
| Available Powder Sizes | Type 4, Type 5 | IPC J-STD-005B | Depends on alloy selection |
